
ISL28325, ISL28345
2
September 27, 2011
FN7854.0
Ordering Information
PART NUMBER
PART
MARKING
TEMP RANGE
(°C)
PACKAGE
(Pb-Free)
PKG.
DWG. #
ISL28325FBZ
28325 FBZ
-40 to +125
8 Ld SOIC
M8.15E
ISL28325FUZ
8325Z
-40 to +125
8 Ld MSOP
M8.118B
ISL28345FBZ
28345 FBZ
-40 to +125
14 Ld SOIC
MDP0027
NOTES:
1. Add “-T*” suffix for tape and reel. Please refer to
TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-
free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device information page for
ISL28325, ISL28345. For more information on MSL please see techbrief
Pin Configurations
ISL28325
(8 LD SOIC, MSOP)
TOP VIEW
ISL28345
(14 LD SOIC)
TOP VIEW
VOUT_A
-IN_A
+IN_A
V -
1
2
3
4
8
7
6
5
V+
VOUT_B
-IN_B
+IN_B
+
-
+-
-+
-
+
-+
-
+
BC
AD
VOUT_A
-IN_A
+IN_A
V +
1
2
3
4
5
6
7
10
9
8
11
12
13
14
+IN_B
-IN_B
VOUT_B
V -
+IN_C
-IN_C
VOUT_C
VOUT_D
-IN_D
+IN_D